Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users (Marco Chiappetta/Forbes)
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Marco Chiappetta / Forbes : Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users — As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.
